BGA Automatic Mounting for Heat Slug, Semiconductor Equipment,Semiconductor
Mounting of heat slug agter wire bonding and before molding for BGA packages Applicable packages: all kinds of BGA-series packages Operating range: BGA27*27mm~40*40mm substrates Eqyipment functions: 1. Adopts double-headed design, one for dispensing adhesive, one for mount heat slub, with a high production speed. 2. The high-speed single-point programmable dispensing system has stable adhesive output and high position accuracy. 3. The dispensing system is programmable control with stable adhesive output and high position accuracy. 4. Automatic positioning detection for substrates. 5. A correction mechanism for heat slug positions to prevent heat slug mounting positions from deviating. 6. A fast clamp replacement system. UPH: 1300 for BGA37.5*37.5 LOAD CAPACITY: 4 magazines OPERATING SYSTEM: Windows 2000/Industrial computer VOLTAGE&FREQUENCY: AC220V, single-phase, 50/60Hz AMPERAGE: 12A AIR PRESSURE: 5~7kg/cm2
Mounting of heat slug agter wire bonding and before molding for BGA packages Applicable packages: all kinds of BGA-series packages Operating range: BGA27*27mm~40*40mm substrates Eqyipment functions:
Application: Printing of BGA substrate for front-end process and bar-codes for production management Applicable packages: all kinds of BGA series packages Area of substrate printable: unlimited Equi
Application :Testing of BGA finished packages in back-end process for open and short. Equipment functions: 1.Uses long-life reed relay. 2.A pogo pin for automatic analysis checks for damage. 3.Can s
Application: testing of Flip Chip/Viper (EBGA) packages for open and short after wire bonding or chip bonding. Testable packages: single Board - type series packages of Flip Chip / Viper / EBGA Test
Testing of BGA products for open and short after wire-bonding. Equipment functions: 1. Reverse input/output detection design. 2. The input/output push rod protection mechanism prevents the push rod
Testing of BGA products for open and short after wire-bonding. Equipment functions: 1. Reverse input/output detection design. 2. The input/output push rod protection mechanism prevents the push rod
Application: Automatic vision inspection of FCBGA SMT assembly ( Before Chip Bonding ) Applicable packages: All Component SMT related Flip Chip packages. Equipment functions: 1.The min. inspection ar
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