Flip Chip / Viper (EBGA) Open and Short Tester, Semiconductor Equipment,Semicond
Application: testing of Flip Chip/Viper (EBGA) packages for open and short after wire bonding or chip bonding. Testable packages: single Board - type series packages of Flip Chip / Viper / EBGA Testable package sizes: 27x27mm - 40x40mm Resistance : 1 ?[ - 40 M ?[ Capacitance: 1fF - 400fF Inductance: 1uH - 40H Voltage: 0V - 100V Equipment functions: 1.Detection design for reverse input and output. 2.Automatic pass/reject categorization after Open and Short testing. 3.Uses long-life Reed Relay. 4.A probe for automatic analysis checks for damage. 5.Can set the number of re-checks for rejects. 6.Can adjust test height for packages to be tested. 7.The test ball pitch can reach up to 1.0 mm. 8.Uses a long-life pogo pin. 9.The patent suction design will not damage packages or cause a wire collapse or short-circuit. 10.It takes only 20 minutes to replace a package kit. Test system: Uses test factory-level load board with a low error rate. The socket used can be used together with backend finished packages for tests. UPH: 450 for 27x27mm Package Size Test capacity: 4 magazines Operating system: Windows 2000 / Industrial computer Voltage & frequency: AC 220V, single-phase, 50/60 Hz Amperage: 15A Air pressure: 5 - 7 kg/cm2
Testing of BGA products for open and short after wire-bonding. Equipment functions: 1. Reverse input/output detection design. 2. The input/output push rod protection mechanism prevents the push rod
Testing of BGA products for open and short after wire-bonding. Equipment functions: 1. Reverse input/output detection design. 2. The input/output push rod protection mechanism prevents the push rod
Application: Automatic vision inspection of FCBGA SMT assembly ( Before Chip Bonding ) Applicable packages: All Component SMT related Flip Chip packages. Equipment functions: 1.The min. inspection ar
Application:Ball and lead Inspection or finished packages for back-end process . Inspection packages: BGA / QFP / LQFP / TQFP / TSOP series packages Inspection package sizes:7x7mm ~ 40x40mm, No. of
Application: Inspection of finished packages and marking in the back-end process . Inspection packages: BGA series packages Inspection package sizes: 5x5mm ~ 40x40mm, No. of balls unlimited. Inspect
Mounting of heat slug agter wire bonding and before molding for BGA packages Applicable packages: all kinds of BGA-series packages Operating range: BGA27*27mm~40*40mm substrates Eqyipment functions:
Mounting of heat slug agter wire bonding and before molding for BGA packages Applicable packages: all kinds of BGA-series packages Operating range: BGA27*27mm~40*40mm substrates Eqyipment functions:
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