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Stamping parts
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Stamping parts: * Design and manufacture the tooling of ultra-precise rapid stamping The minimum pitch is 0.3mm The minimum thickness of material is 0.05mm The width of gap is 0.15mm. * Stamping for
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CompactFlash Card Connector
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CompactFlash card connector: * Type I & II, header & ejector, top & mounting available. * Guarantee the coplanarity is within 0.1mm max. after IR reflow of SMT process. * Full automated assembly manu
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CompactFlash Card Connector
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CompactFlash card connector: * Type I & II, header & ejector, top & mounting available. * Guarantee the coplanarity is within 0.1mm max. after IR reflow of SMT process. * Full automated assembly manu
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CompactFlash Card Connector
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CompactFlash card connector: * Type I & II, header & ejector, top & mounting available. * Guarantee the coplanarity is within 0.1mm max. after IR reflow of SMT process. * Full automated assembly manu
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CompactFlash Card Connector
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CompactFlash card connector: * Type I & II, header & ejector, top & mounting available. * Guarantee the coplanarity is within 0.1mm max. after IR reflow of SMT process. * Full automated assembly manu
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CompactFlash Card Connector
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CompactFlash card connector: * Type I & II, header & ejector, top & mounting available. * Guarantee the coplanarity is within 0.1mm max. after IR reflow of SMT process. * Full automated assembly manu
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CompactFlash Card Connector
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CompactFlash card connector: * Type I & II, header & ejector, top & mounting available. * Guarantee the coplanarity is within 0.1mm max. after IR reflow of SMT process. * Full automated assembly manu
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CompactFlash Card Connector
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CompactFlash card connector: * Type I & II, header & ejector, top & mounting available. * Guarantee the coplanarity is within 0.1mm max. after IR reflow of SMT process. * Full automated assembly manu
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CompactFlash Card Connector
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CompactFlash card connector: * Type I & II, header & ejector, top & mounting available. * Guarantee the coplanarity is within 0.1mm max. after IR reflow of SMT process. * Full automated assembly manu
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