Aluminum subrack and panels chromate surfaces. Rapid assembly. EMC construction and EMC panels. 7U height x 84T width x 285m/m depth. Easy access to internal installations. Meet IEEE1101.10 and CompactPCI standard. ISO 9001 certified.
Aluminum subrack and panels chromate surfaces. Rapid assembly. EMC construction and EMC panels. 7U height x 32T width x 285m/m depth. Easy access to internal installations. Meet IEEE1101.10 and
Aluminum subrack and panels chromate surfaces. Rapid assembly. EMC construction and EMC panels. 9U height x 84T width x 285m/m depth. Easy access to internal installations. Meet IEEE1101.10 and
Aluminum subrack and panels chromate surfaces. Rapid assembly. EMC construction and EMC panels. 4U height x 84T width x 285m/m depth. Easy access to internal installations. Meet IEEE1101.10 and
Aluminum subrack and panels chromate surfaces. Rapid assembly. EMC construction and EMC panels. 4U height x 84T width x 285m/m depth. Easy access to internal installations. Meet IEEE1101.10 and
Aluminum subrack and panels chromate surfaces. Rapid assembly. EMC construction and EMC panels. 7U height x 84T width x 285m/m depth. Easy access to internal installations. Meet IEEE1101.10 and
CompactPCI 2.0 R3.0 3U/6U Backplane Key Features : •Conforms to PICMG 2.0 R3.0 •Supports Hot Swap feature of PICMG 2.1 R2.0 •VI/O are user selectable to a +5V or +3.3V •All s
CompactPCI 2.0 R3.0 3U/6U Backplane Key Features : •Conforms to PICMG 2.0 R3.0 •Supports Hot Swap feature of PICMG 2.1 R2.0 •VI/O are user selectable to a +5V or +3.3V •All s
CompactPCI 2.0 R3.0 3U/6U Backplane Key Features : •Conforms to PICMG 2.0 R3.0 •Supports Hot Swap feature of PICMG 2.1 R2.0 •VI/O are user selectable to a +5V or +3.3V •All s
CompactPCI 2.0 R3.0 3U/6U Backplane Key Features : •Conforms to PICMG 2.0 R3.0 •Supports Hot Swap feature of PICMG 2.1 R2.0 •VI/O are user selectable to a +5V or +3.3V •All s
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