Combined IC packaging and PCB assembly technologies Specific testing service tailored for customers (AOI, ATE / ICT) Flexible PCB assembly, thin PCB assembly No-clean and aqueous cleaning processes LTCC assembly Surface Mount Technology: ?gBGA, Flip Chip, CSP, ACF, TCP/TAB assembly technologies Pick, place and re-assembly ?g BGA components, and to utilize X-Ray inspection for BGA process verification Down to 0402,0201, 0.4mm pitch For more detail,Please contact us immediately.
IC Packaging Services OSE offers IC package design and fabricates a full array of packages, with pin counts from 8 to more than 830. We also offer comprehensive IC testing capabilities that verify f
IC Packaging Services OSE offers IC package design and fabricates a full array of packages, with pin counts from 8 to more than 830. We also offer comprehensive IC testing capabilities that verify f
IC Packaging Services OSE offers IC package design and fabricates a full array of packages, with pin counts from 8 to more than 830. We also offer comprehensive IC testing capabilities that verify f
Besides a variety of packaging services, OSE also offers comprehensive IC testing capabilities that verify function availability of logic, memory, analog, mixed signal and RF devices for customers.
Besides a variety of packaging services, OSE also offers comprehensive IC testing capabilities that verify function availability of logic, memory, analog, mixed signal and RF devices for customers.
Besides a variety of packaging services, OSE also offers comprehensive IC testing capabilities that verify function availability of logic, memory, analog, mixed signal and RF devices for customers.
Combined IC packaging and PCB assembly technologies Specific testing service tailored for customers (AOI, ATE / ICT) Flexible PCB assembly, thin PCB assembly No-clean and aqueous cleaning processes L
Combined IC packaging and PCB assembly technologies Specific testing service tailored for customers (AOI, ATE / ICT) Flexible PCB assembly, thin PCB assembly No-clean and aqueous cleaning processes L
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