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Computers, Software & Peripherals /  Computer Accessories /  Cables / Adapters / 
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Producer information
Company:
LINKTEC TECHNOLOGIES CO., LTD
 
Address:
 
Phone:
+886-2-22670439

HDMI Receptacle A Type Connector, with PCB, No Lock


[Material] Housing: Glass Filled Heat-Resisted RESIN, UL94-0 Terminal: Copper Alloy Shield: Zinc Alloy PCB: FR-4 DIP Back Plug: PE [Plating] Terminal (Contact Area): Gold Terminal (Under-Plating): Nickel Solder Tail Area: Tin Alloy (Lead Free) Shell (Plating): see note 6, Nickel Shell (Under-Plating): Copper Alloy PCB: Gold over Copper Alloy [Mechanical Characteristics] Insertion Force: 44.1N (Max.) Extraction Force: 9.8N (Min.)/ 39.2N (Max.) Mating Cycle: 5000 cycles Contact Pull Out Force: 5.9N/ Pin (Min.) [Electrical Characteristics] Rating Current: 0.5A Rating Voltage: 40V Contact Resistance: 50m Ohms (Max.) Insulation Resistance (Unmated): 100M Ohms Min. at 500 VDC Insulation Resistance (Mated): 10M Ohms Min. at 150 VDC Dielectric Withstanding Voltage: 300V AC/ 1 Minute Operating Temperature: -20 XC ~ +85 XC Storage Temperature: -20 XC~ +65 XC Operation/ Storage Humidity: 95% or less [General Tolerance] 0.25mm unless otherwise specified [Order Information] 011-XX1X 07: Shell V Nickel Plating 17: Shell V 1 u Gold Plating 06: Shell V 3 u Gold Plating E: 15 u Gold G: 30 u Gold

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Housing of 30 positions Wire to Board Connector (Crimp Type)
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[Materials] Housing: Thermal Temperature RESIN, Glass Filled, UL94-V0; Ivory Terminal: Copper Alloy Metal Shell: Copper Alloy [Plating] Terminal: Gold over Nickel For detailed drawing, please feel
Housing of 30 positions Wire to Board Connector (Crimp Type)
Housing of 30 positions Wire to Board Connector (Crimp Type) (Housing of 30 positions Wire to Board Connector (Crimp Type))
[Materials] Housing: Thermal Temperature RESIN, Glass Filled, UL94-V0; Ivory Terminal: Copper Alloy Metal Shell: Copper Alloy [Plating] Terminal: Gold over Nickel For detailed drawing, please feel
Housing of 30 positions Wire to Board Connector (Crimp Type)
Housing of 30 positions Wire to Board Connector (Crimp Type) (Housing of 30 positions Wire to Board Connector (Crimp Type))
[Materials] Housing: Thermal Temperature RESIN, Glass Filled, UL94-V0; Ivory Terminal: Copper Alloy Metal Shell: Copper Alloy [Plating] Terminal: Gold over Nickel For detailed drawing, please feel
063 Wire to Board Connector
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[Materials] Housing: Thermal Temperature RESIN, Glass Filled, UL94-0; Black Terminal: Copper Alloy Metal Shell: Copper Alloy Lock Spring: Stainless Steel [Plating] Terminal: Gold over Nickel Metal S
063 Wire to Board Connector
063 Wire to Board Connector (063 Wire to Board Connector)
[Materials] Housing: Thermal Temperature RESIN, Glass Filled, UL94-0; Black Terminal: Copper Alloy Metal Shell: Copper Alloy Lock Spring: Stainless Steel [Plating] Terminal: Gold over Nickel Metal S
063 Wire to Board Connector
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[Materials] Housing: Thermal Temperature RESIN, Glass Filled, UL94-0; Black Terminal: Copper Alloy Metal Shell: Copper Alloy Lock Spring: Stainless Steel [Plating] Terminal: Gold over Nickel Metal S
30 positions Wire to Board Connector (Solder Type)
30 positions Wire to Board Connector (Solder Type) (30 positions Wire to Board Connector (Solder Type))
[Materials] Housing: Thermal Temperature RESIN, Glass Filled, UL94-V0; Black Terminal: Copper Alloy Metal Shield: Copper Alloy [Plating] Terminal: 5 u Gold overall/ 50 u Nickel Min. over upder-p
30 positions Wire to Board Connector (Solder Type)
30 positions Wire to Board Connector (Solder Type) (30 positions Wire to Board Connector (Solder Type))
[Materials] Housing: Thermal Temperature RESIN, Glass Filled, UL94-V0; Black Terminal: Copper Alloy Metal Shield: Copper Alloy [Plating] Terminal: 5 u Gold overall/ 50 u Nickel Min. over upder-p
30 positions Wire to Board Connector (Solder Type)
30 positions Wire to Board Connector (Solder Type) (30 positions Wire to Board Connector (Solder Type))
[Materials] Housing: Thermal Temperature RESIN, Glass Filled, UL94-V0; Black Terminal: Copper Alloy Metal Shield: Copper Alloy [Plating] Terminal: 5 u Gold overall/ 50 u Nickel Min. over upder-p

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