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CF Card
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MATERIAL Housing:High Temperature Thermoplastic. Contact:Copper Alloy. Ped:Brass PLATING Contact:Underplated:50u`` Min Ni. Contact area:Select Gold over Ni Plated. Solder Tail:100u`` min Sn/Pb over N
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CFC Card
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MATERIAL Housing:High Temperature Thermoplastic. Contact:Copper Alloy. Ped:Brass PLATING Contact:Underplated:50u`` Min Ni. Contact area:Select Gold over Ni Plated. Solder Tail:100u`` min Sn/Pb over N
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Memory card connectors
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Material Insulator: UL 94V-0, Ny;on+30% C/F, Black Contacts: Phosphor Bronze Cover: Brass Soldering Pad: Brass Finish Terminal Underplate 50µ`` Ni Min Overall Contact Area Plated 10µ`` A
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PLCC SOCKET CONNECTORS
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Meterials: 1. Contact material: Phosphor bronze 2. Contact plating: 150u`` tin over 40u`` nickel 3. Insulator:Hi-temp pps UL 94V-0
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PLCC SOCKET CONNECTORS
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Meterials: 1. Contact material: Phosphor bronze 2. Contact plating: 150u`` tin over 40u`` nickel 3. Insulator:Hi-temp pps UL 94V-0
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SATA CONNECTORS
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Mateial Housing:LCP,UL 94V-0 rated, Color Black. Contact:Brass Plating:Gold plating over Nickel on contact arer; Tin/Lead plating on terminal. Electrical Specification Current Rating:1.5 Ampere per c
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SATA CONNECTORS
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Mateial Housing:LCP,UL 94V-0 rated, Color Black. Contact:Brass Plating:Gold plating over Nickel on contact arer; Tin/Lead plating on terminal. Electrical Specification Current Rating:1.5 Ampere per c
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