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Pin Header connector
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. Material. Housing: 30% Glass filled PBT UL94V-0. Contacts: Brass. Plating: Gold plated: 2u"" over 50u"" nickel. Tin plated: 100u"" over 50u"" nickel. Electrical Characteristics:
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SLOT CONNECTOR
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. Material. Housing: 30% Glass filled PBT UL94V-0. Contacts: Brass or Phosphor Bronze. Plating full gold or selected gold in mating area. 100u"" min. tin-lead on termination area. with ent
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Box Header Series
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. Material. Housing: 30% Glass filled PBT UL94V-0. Contacts: Brass. Plating: Selective gold plated: gold plated on mating area and nickel plated on wire cutting area. Gold plated: 2u"" over 50u"" nick
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connector
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. Material. Housing: 30% Glass filled PBT UL94V-0. Contacts: Brass or Phosphor Bronze. Plating: Selective gold plated: gold plated on mating area and nickel plated on wire cutting area. Gold pla
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d-sub connector
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. Material. Housing: 30% Glass filled PBT UL94V-0. Contacts: Phosphor Bronze. Shell: Steel, 100u"" Tin Over 50u"" min Nickel. Clinch Nut: Brass, 100u"" min Nickel Plated. Screwlock: Brass, 100u""
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Female Header connector
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. Material. Housing: 30% Glass filled PBT UL94V-0. Contacts: Brass or Phosphor Bronze. Plating: Selective gold plated: gold plated on. mating area and nickel plated on wire cutting area. Gold
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IC SOCKET
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. Material. Housing: 30% Glass filled PBT UL94V~0. Contacts: Brass or Phosphor Bronze. Plating: Selective gold plated: gold plated on. mating area and nickel plated on wire cutting area. Go
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PCB
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PCB-03
Material:FR-4
Layer Coverage:2Layers
Thickness:1.0mm
Surface Technique:Gold Plating
Line Width/Space:8mils/8mils
Solder Mask Color:Green
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PCB-01
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Material:FR-4
Layer Coverage:2Layers
Thickness:1.6 mm
Surface Technique:Gold Plating
Line Width/Space:12mils/12mils
Solder Mask Color:Blue
Special : 200x 800mm
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