Resin-bond Dicing Blades, Metal-bond (sintered) Dicing Blades

Our factory is a world leader in the development and manufacturer of dicing blades and processes used in the dicing of silicon-based ics, hard material microelectronic components (mecs) and in package singulation in china.Nickel-bond dicing bladesThe nickel binder provides longer blade life and lower wear rate and together with the abrasive makes nickel-bond blades a perfect choice for soft material applications such as: Pcb, silicon and bgaBlade thickness varies from 0.8 mil to 20 mil (depending on diamond grit size)Diamond grit size ranges from 2-4 microns to 70 microns (depending on blade thickness)

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