1.Pinciple de MCV,, 2.Metal-CVD,, 3.PE-CVD,, 4.HDP-CVD,, 5.LP-CVD,, 6.UHV-CVD

@ B Aav | h Ö H] Ç e`úÅç ^ G B D Þ u @ [ T B Aav u q | B Aav P Aav B | ó H Aav O Þ z Ì L q ja × Á | H B

@ B Þ z ï P Â e Ì | | ó | H G B Þ P z ÌÂ | p | xav ó `| ì H 1. U s X v | b W ô E Y`a ` ê T 2. u s X v | b W I`A

(1) FMEA À P Í un × n R (2) ] PFMEA é I k (3) y (FMEA é K I

1.Int duction,, 2.Ultra-mince Oixde Préparation,, 3.Intrinsic P perties of Thermal Oxide and characterization,, 4.Oxide Fiabilité,, 5.Limi of oxide Scaling,, 6.High-k dielectric Technology

1.Int duction,, 2.Ultra-mince Oixde Préparation,, 3.Intrinsic P perties of Thermal Oxide and characterization,, 4.Oxide Fiabilité,, 5.Limi of oxide Scaling,, 6.High-k dielectric Technology

1.Int duction,, 2.Ultra-mince Oixde Préparation,, 3.Intrinsic P perties of Thermal Oxide and characterization,, 4.Oxide Fiabilité,, 5.Limi of oxide Scaling,, 6.High-k dielectric Technology

@ B W Q P A G B | õ W q L ( A A ÒÂ T { ò Æ z T B v | B P W q Ê Ò è na D Q Þ B vAT

1. O-N - ø H ~ Â ï H 2. Â ï H ~ BÆJ 3. - Í Î (C 4. - Í pc | C Æ 5. - ï E ` N Æ 6. - I Þ 7. - Í �