Dicing Blade

Dicing blades employ the active and superfine pre-alloyed powder as the bonding agent to realize strong holding power. And through designing the metal bond composition and optimizing the processing technics, these blades have excellent cutting performance and low blade wear. As a result, they can be used to cut hard & brittle materials and a variety of semiconductor packages.A strong holding of diamonds during the cutting which enhances blades` life.High strength, high toughness, high wear resistance and high precision.Maintain high cutting ability and high cutting quality in the working condition of high speed rotation and fast feed rate.Saving expensive materials and cost due to the high precision grooving and cutting.

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