 |
|
 |
Description |
 |
|
|
|
|
|
|
|
|
|
Printed circuit board
Layer: 1~22 layersMaterials: FR-4, CEM-3, Teflon, Aluminum, Rogers, High TgSurface finished:Lead Free HASL,Immersion Gold/Tin/Silver, OSP, Gold Finger Plating, Selective Immersion Gold,Gold PlatingMax.Panel Size: 550 * 650mmMin. Finished Holes Size: 0.10mmMicrovias diameter: 0.10 - 0.15mmMin. Line Width/Spacing: 0.075 / 0.075mmCopper Feature to Holes(Outer): ±0.075mmMin. Plated Drills to Copper(inner): 0.25mmMin. Copper to Edge distance: 0.25mmMax. Copper Thickness: 140μmMax. Board Thickness: 4.80 mmMin. Board Thickness: 0.20mmMin. Core Thickness: 0.10mmMin. Soldermask Dam: 0.10mm
 Add to Basket
 Web address
|
|
|
Other goods of this manufacturer : |
|
|
|
|
PCBs
|
|
Layer: 1~22 layersMaterials: FR-4, CEM-3, Teflon, Aluminum, Rogers, High TgSurface finished:Lead Free HASL,Immersion Gold/Tin/Silver, OSP, Gold Finger Plating, Selective Immersion Gold,Gold PlatingMax
|
| |
|
|
|
|
|
|
|
|
|
| Likewise in category "Print Circuit Boards": |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
help
Add to favorite
Favorite products
