1.Introduction of Cu/Low-k Interconnects ,,2.Copper Deposition , ,,3.Diffusion Barriers for Cu ,,4.Reliability Issues In Cu Metallization

1.Introduction of Cu/Low-k Interconnects ,,2.Copper Deposition , ,,3.Diffusion Barriers for Cu ,,4.Reliability Issues In Cu Metallization

1.Pinciple of CVD,,2.Metal-CVD,,3.PE-CVD,,4.HDP-CVD,,5.LP-CVD,,6.UHV-CVD

1.Pinciple of CVD,,2.Metal-CVD,,3.PE-CVD,,4.HDP-CVD,,5.LP-CVD,,6.UHV-CVD

1.Pinciple of CVD,,2.Metal-CVD,,3.PE-CVD,,4.HDP-CVD,,5.LP-CVD,,6.UHV-CVD

v h H ] e G D u @ [ T v u q | v P v H v O z q j | H v z C v n B K D | v H H E v I { Q V W v Q

z P H G z p x v H 1. u s x v b W e ` T 2. u s x v b W B 3. u s x v b e @ T z b I i O A 1. A Z D v

(1) FMEA P i a R (2) ] pFMEA I k (3) y {FMEA I k

1.Introduction,,2.Ultra-thin Oixde Preparation ,,3.Intrinsic Properties of Thermal Oxide and Characterization , ,4.Oxide Reliability, ,5.Limits of Oxide Scaling, ,6.High-k Dielectric Technology