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Информация о производителе
Компания:
Goldlink Tongda Electronics Co., Ltd
 
Адрес:
616,Block 45, Baoan District
 
Телефон:
+86-755-27579310

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GLPOLY thermal pad is featuring a high thermal conductivity of 6.0W/mK, it’s higher than that of most of competitor. Comparing with BQ 5000S35, the data will shows that GLPOLY thermal gap filler pad can perfectly replace the BQ 5000S35. Firstly, the thermal conductivity of GLPOLY thermal gap filler pad is higher that that of BQ 5000S35; the thermal resistance is only 0.16℃in2/W, it’s just one third of BQ 5000S35. Comparison data reflects that GLPOLY thermal gap filler pad offers more excellent thermal performance than BQ5000S35. For the electrical property, the dielectric breakdown voltage is 16KV, it’s 3 times greater than BQ 5000S35’s. this will ensure the stability of performance of devices. The material yields extremely soft characteristics while maintaining elasticity and conformability. Conforms to demanding contours and maintains structural integrity with little or no stress applied to fragile components. The inherent natural tack on both sides assists in application and allows the products to effectively fill gaps, reducing thermal resistance and enhancing the overall thermal performance. GLPOLY thermal gap filler pad is ideal for high-performance application at low stress or pressure.
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Другие товары этого производителя :
Thermal putty ()
GLPOLY The thermal putty gel XK-G50 is a high performance thermal management solution for electronics assembly, it is thermally conductive particle filled silicone gel with high conformability and the
Thermal gap filler ()
Ceramic-filled Two component silicone gels with a high thermal conductivity.The crosslinked thermal compounds do not dry out. The silicone components do not leak out of the compound.100% solids – no
Thermal gap pad ()
Introduction GLPOLY thermal pad is featuring a high thermal conductivity of 6.0W/mK, it’s higher than that of most of competitor. Comparing with BQ 5000S35, the data will shows that GLPOLY thermal

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