Thermal gap filler

Ceramic-filled Two component silicone gels with a high thermal conductivity.The crosslinked thermal compounds do not dry out. The silicone components do not leak out of the compound.100% solids – no cure by-productsUltra-conforminglow-stress applicationsThermal conductivity 3.0W/mK

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Thermal gap pad
	Introduction GLPOLY thermal pad is featuring a high thermal conductivity of 6.0W/mK, it’s higher than that of most of competitor. Comparing with BQ 5000S35, the data will shows that GLPOLY thermal

thermal gap pad
	GLPOLY thermal pad is featuring a high thermal conductivity of 6.0W/mK, it’s higher than that of most of competitor. Comparing with BQ 5000S35, the data will shows that GLPOLY thermal gap filler pad

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