| Careful management of thermal interface is crucial to maintaining the reliability and extending the life cycle of electronic devices and equipments. As technology advances, new electronics generation requires higher power in small packages, the challenges associated with thermal management become more intense. Thermal interface materials are required: Higher thermal conductivity Low thermal impedance Greater compliance and conformability High stability and reliability Greater adhesion Ease of handling, application and use Longer service life GLPOLY has been a provider of thermal materials for ten years and has a successful history of providing thermal interface materials expertise and commitment to developing new high performance products including thermal gap pad, thermal gap filler, thermal putty, thermal compound and more to meet the thermal challenges of system designers in the line of automotive electronics, telecommunications, computer, consumer electronics, military, power conversion and motor control and more. |
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