1. Einführung von Cu / Low-k Interconnects, 2.Copper Deposition,,, 3.Diffusion Barrieren für Cu, 4.Reliability Issues in Cu-Metallisierung

1. Einführung von Cu / Low-k Interconnects, 2.Copper Deposition,,, 3.Diffusion Barrieren für Cu, 4.Reliability Issues in Cu-Metallisierung

1. Einführung von Cu / Low-k Interconnects, 2.Copper Deposition,,, 3.Diffusion Barrieren für Cu, 4.Reliability Issues in Cu-Metallisierung

1.Pinciple von CVD-, 2.Metal-CVD, 3.PE-CVD, 4.HDP-CVD, 5.LP-CVD, 6.UHV-CVD

1.Pinciple von CVD-, 2.Metal-CVD, 3.PE-CVD, 4.HDP-CVD, 5.LP-CVD, 6.UHV-CVD

1.Pinciple von CVD-, 2.Metal-CVD, 3.PE-CVD, 4.HDP-CVD, 5.LP-CVD, 6.UHV-CVD

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